|
Since 2000, we deepened the field of the MEMS. Our measuring instruments
have been adapted according to the requests and the characterization of
MEMS became a standard for CSM.
We characterized:
- The Friction of Polysilicon Microshutter
- The Hardness and elastic modulus of Bonding Pads
- The delamination of Micro-Slit Reflective Coatings
- Force constant as a function of position of accelerometers
- Cracks on Printer Heads in pressure testing
- Stiffness and displacement characteristics of micro switches
- .etc.
Ask us for new applications!
|
