Micro Electronics Mechanical System (MEMS)

Since 2000, we deepened the field of the MEMS. Our measuring instruments have been adapted according to the requests and the characterization of MEMS became a standard for CSM.

We characterized:

  • The Friction of Polysilicon Microshutter
  • The Hardness and elastic modulus of Bonding Pads
  • The delamination of Micro-Slit Reflective Coatings
  • Force constant as a function of position of accelerometers
  • Cracks on Printer Heads in pressure testing
  • Stiffness and displacement characteristics of micro switches
  • .etc.

Ask us for new applications!

 

 

 

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